|
17µm
-1024x768 |
Performances
- Temperature range: -40°C to +85°C.
- Array operability > 99.9%
- Signal response: 10 mV/K.
- Standard deviation ≤ 1,5%.
Features
- User friendly interface.
- 2 analog video outputs.
- Weight ≤ 30g.
- Dimensions (mm): 41.2x30x6.6
-Readout configuration driven by serial link |
25µm-640x480
|
Performances
-Typical TEC
environmental temperature range
(FPA @30°C): -30°C to + 60°C
-Temperature range: -40°C to +85°C.
-Array operability > 99.9%
-Signal response: 7 mV/K.
-Standard deviation ≤ 1,5%.
Features
-User friendly interface.
-Integrated TEC for FPA temperature
stabilization.
-Weight ≤ 30g.
-Dimensions (mm): 32x23.5x7.4 |
|
17µm
- 640x480 |
Performances
- Temperature range: -40°C to
+85°C.
- Array operability > 99.9%
- Signal response: 7 mV/K.
- Standard deviation ≤ 1,5%.
Features
- User friendly interface.
- 1 digital video output (14 bits/30 Hz)
and 1 analog video output (60 Hz)
- Weight ≤ 6g.
- Dimensions (mm): 24.2x24.2x4.1
- Tecless ceramics package |
25µm - 384x288 |
Performances
-Typical TEC environmental temperature range
(FPA @30°C): -30°C to + 60°C
-Temperature range: -40°C to +85°C.
-Array operability > 99.9%
-Signal response: 7 mV/K.
-Standard deviation ≤ 1,5%.
Features
-User friendly interface.
-Single analog video output.
-Integrated TEC for FPA temperature
stabilization.
-Weight ≤ 25g.
-Dimensions
(mm):32x23.5x7.4 |
|
35µm - 384x288
|
Performances
- Typical TEC environmental temperature
range
(FPA @30°C): -30°C to + 60°C
- Temperature range: -40°C to +85°C.
- Array operability > 99.9%
- Signal response: 7 mV/K.
- Standard deviation ≤ 1,5%
Features
- User friendly interface.
- Single analog video output.
- Integrated TEC for FPA temperature
stabilization.
- Weight ≤ 25g.
- Dimensions (mm): 32x23.5x7.4 |
MW
1280x1024 HgCdTe (15µm pitch)
|
ARRAY FEATURES
Pixel pitch: 15 µm
x15µm
Material spectral response:
0.5 µm - 5.3 µm
Detector spectral response:
3.7 µm - 4.8 µm (band pass filter)
FPA Operating Temperature:
77K -110K
ROIC FEATURES
Selection: parallel or
serial electrical interface
Modes: snap shot operation,
direct injection input circuit, integrate
while read mode, programmable integration
time, anti-blooming, image
invert/revert/inverse
Window modes: fixed
(central 1280x1024; 1024x1024) or random
(one or two windows of any size down to
256x1)
Max charge handling capacity:
4.2 106 e- (for 100%well fill)
etc |
|
LW
640x512 QWIP (20µm pitch) |
ARRAY FEATURES
Pixel pitch: 20 µm
x20µm
QWIP spectral
response: λpeak = 8.5 µm
± 0.1 µm,
FPA Operating Temperature:
70K to 75K optimum
ROIC FEATURES
Selection: parallel or
serial electrical interface
Modes: snap shot operation,
direct injection input circuit, integrate
while read mode, programmable integration
time, anti-blooming, image
invert/revert/inverse
Window modes: fixed
(640x512, 640x480, 384x288) or random
Max charge handling capacity:
10.3 106 e- (for 100%well fill)
etc |
SW HgCdTe SWIR |
ARRAY FEATURES
Format: 1000x256
Pixel pitch:
30 µmx30 µm
Material spectral response:
0.8µm-2.5µm
FPA Operating Temperature:
up to 200 K
ROIC FEATURES
Modes: snap shot operation,
integrate while read mode, programmable
integration time, anti blooming system
Input stage: Capacitance
TransImpedance Amplifier (CTIA)
Charge handling capacity:
0.4 106 / 10.6 106 (for 100% well fill)
Electrical dynamic range: >
2 V (75 dB)
Readout noise: < 150 e-
(for 0.4 Me- gain) and < 450 e- (for 1.6
Me-gain)
Signal outputs: 4 or 8
(user selectable) |
